Beneq TFS200 Plasma ALD System

The Beneq TFS200 is a research-grade atomic layer deposition system supporting both thermal and plasma-enhanced (PEALD) processes across a 25 to 500C range. It handles substrates up to 200 x 200mm as well as 3D and high-aspect-ratio parts, growing highly conformal, precisely thickness-controlled films. Available materials include Al2O3, TiO2, Ta2O5, ZnO, SiO2, SiN, NiO, ITO and MoO, plus nitrides such as TiN via the plasma option.