Equipment Information

Lesker PROLine200 · Metal Evaporator and Sputter Coater

  • Internal Name: EVAP04

Description

Open-chamber PVD system suitable for samples up to 200mm wafer size (at request), with thermal, e-beam and sputter capabilities. Able to evaporate the following materials using e-beam evaporation: Titanium, Aluminium, Platinum, Nickel, Chromium, Germanium Able to evaporate the following materials using thermal evaporation: Gold/Germanium, Gold (short, medium or long throw), Silver. Able to evaporate the following materials using sputtering: Aluminium, Titanium, Nickel/Chrome, Gold, Niobium, ITO, IGZO Requires time to pump the sample down from atmosphere before the sample is ready for deposition - allow 3 hours. Please ensure you inform ICS staff of the required materials to be deposited before you are ready to load your sample (use notes section of booking).

Process Type(s)

Physical Vapour Deposition

EVAP04 image

← Back to Equipment List