Lesker PROLine200
Metal Evaporator and Sputter Coater
Process types
Physical Vapour Deposition
Description
Open-chamber PVD system suitable for samples up to 200mm wafer size (at request), with thermal, e-beam and sputter capabilities.
Able to evaporate the following materials using e-beam evaporation: Titanium, Aluminium, Platinum, Nickel, Chromium, Germanium
Able to evaporate the following materials using thermal evaporation: Gold/Germanium, Gold (short, medium or long throw), Silver.
Able to evaporate the following materials using sputtering: Aluminium, Titanium, Nickel/Chrome, Gold, Niobium, ITO, IGZO
Requires time to pump the sample down from atmosphere before the sample is ready for deposition - allow 3 hours. Please ensure you inform ICS staff of the required materials to be deposited before you are ready to load your sample (use notes section of booking).