A heated process module and a magnetic confinement chamber give a higher plasma density than conventional ICPs (by a factor of ~10x). Higher plasma density means higher etch rates can be achieved and utilised for etching strongly bonded materials. The Synapse tool is routinely used for etching of deep features in dielectric materials including silicon oxide, quartz and glass. Other low volatility materials, such as SiC, AlScN, are also easily processed by the Omega SynapsEtch module. Our system is optimized for etching of SiO2 and SiN layers with Optical endpoint system. Process gases include O2, Ar, He, N2, CF4, H2, C4F8 and SF6.
Plasma Etch and Deposition