Bank holiday 25 Dec
Bay 10 Translational Research Hub
Internal name
ICP5/DET13
Equipment managers
Elizabeth Beaumont
Stuart Thomas
Process types
Plasma Etch and Deposition
Description
A heated process module and magnetic confinement chamber give a plasma density around 10x higher than conventional ICPs, enabling high etch rates for strongly bonded materials. The Synapse/SynapsEtch tool is routinely used for deep features in dielectrics including silicon oxide, quartz and glass, and low-volatility materials such as SiC and AlScN. Optimised for etching SiO2 and SiN with an optical endpoint system; process gases include O2, Ar, He, N2, CF4, H2, C4F8 and SF6.
