Buehler Metaserve

Substrate Thinning
Bank holiday 25 Dec N/3.05 Queen's Buildings
Internal name
LAP01
Equipment manager
Tyrone Jones
Process types
Packaging and Back End Processing
Description
Manual bench-top grinder-polisher for lapping and polishing small tiles and samples up to about 1 inch. A variable-speed rotating platen takes SiC papers, diamond lapping films or polishing cloths and suspensions down to sub-micron grades, for controlled substrate thinning and surface preparation.