Internal name
MCS8 RCD8 Spinner & HP8 3.1
Process types
Resist Coat and Develop
Description
A modular system for photoresist coating of wafers, featuring the following components:
RCD8 semi-automated spin coater:
Standard wafers up to 200mm; square substrates up to 150mm x 150mm
Edge bead removal and back-side rinse functionality
Automated dispense options and programmable recipes
HP8 200mm hotplate (x2):
Quickstart and programmable recipe options
Homogeneous temperature distribution
Optional nitrogen environment and hotplate vacuum
VP8 Vapour Primer:
Programmable surface conditioner for application of HDMS