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Bay 10 Translational Research Hub
Internal name
PECVD1
Equipment managers
Elizabeth Beaumont
Stuart Thomas
Process types
Plasma Etch and Deposition
Description
Plasma-enhanced chemical vapour deposition (PECVD) system on the SPTS Delta platform for depositing dielectric thin films including SiO2, SiN, SiON, amorphous silicon and TEOS. Optimised for low-temperature processing (typically below about 200C) with good step coverage, and RF power modulation to tune film stress between compressive and tensile states.
