Bank holiday 25 Dec
Bay 10 Translational Research Hub
Internal name
PECVD2
Equipment managers
Elizabeth Beaumont
Stuart Thomas
Process types
Plasma Etch and Deposition
Description
Plasma-enhanced chemical vapour deposition (PECVD) system on the Oxford Instruments PlasmaPro 800 platform for depositing dielectric films such as SiO2, SiN and SiON for passivation, photonics and general device layers. The open-load table supports full 300mm wafers or batches of smaller substrates, with laser interferometry and/or optical emission endpoint control and temperature-controlled electrodes.
