Loadpoint Nanoace 3

Dicing Saw
Unavailable until 15 Oct, 00:00 Bay 15 Translational Research Hub
Internal name
SAW01
Equipment managers
Tyrone Jones
Stuart Thomas
Process types
Packaging and Back End Processing
Description
Loadpoint precision dicing saw for die singulation of semiconductor wafers and substrates up to 6 inch. A high-speed air-bearing spindle with vision alignment and closed-loop encoders gives accurate, repeatable cuts through silicon, compound semiconductors and hard substrates.
SAW01 image