ADT 7900 DUO 8" dicing system

Dicing Saw
Bank holiday 25 Dec Bay 15 Translational Research Hub
Internal name
SAW02
Equipment managers
Tyrone Jones
Stuart Thomas
Process types
Packaging and Back End Processing
Description
ADT 7900 DUO automatic dual-spindle dicing saw for high-throughput die singulation of wafers and substrates up to 8 inch (200mm). Two facing spindles dice simultaneously to double productivity, with an automated vision system for alignment, Y-offset correction and kerf checking. Handles IC wafers plus hard materials such as glass, quartz, sapphire and ceramics.
SAW02 image