Manual Cleave

Scribe Bench

Bank holiday 25 Dec Bay 15 Translational Research Hub

Internal name

SCRIBE01

Equipment manager

Tyrone Jones

Process types

Packaging and Back End Processing

Description

Manual scribe-and-cleave station for separating small semiconductor samples by scribing a guideline and cleaving along the crystal planes. Suited to hand cleaving of individual dies and small pieces of silicon and compound-semiconductor wafers for clean, oriented facets.