Bank holiday 25 Dec
Bay 15 Translational Research Hub
Internal name
SCRIBE02
Equipment managers
Tyrone Jones
Tom Peach
Process types
Packaging and Back End Processing
Description
ATV precision manual diamond scriber for scribe-and-break separation of semiconductor wafers, glass and ceramic substrates. Fine X and rotational adjustment with a vacuum chuck and cross-hair microscope aligned to the scribe trace, plus adjustable tool angle, force and touch-down points for repeatable scribing prior to cleaving.