Equipment & Facilities

Our state-of-the-art equipment and modern facilities enable researchers and industry to work together.

The ICS moved to its new cleanroom in 2023. This purpose built 1500m2 facility enabled the scale-up to 200mm (8”) wafer capacity, critical for industrial relevance. With support from both the EPSRC and the Welsh Government via European Regional Development Funds, the ICS has invested in new tooling to provide a wide range of processing options. This ensures we can deliver a flexible service to meet the widest possible range of fabrication demands in terms of materials, geometries and scale from small pieces to 200mm wafers.

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  Bruker DektakXT Advanced System (DXT-A) · Profilometer   Bruker Dimension ICON · Atomic Force Microscope   Hitachi SU8320 High Resolution · Scanning Electron Microscope   KLA P17 · Profilometer   Keyence VHX-7100 · Optical Microscope   Micromanipulator 450PM-B · Probe Station and SMU   Semilab SE-2000 · Ellipsometer   Thermo Fisher Scientific Helios 5 UC Ion Beam Microscope · Focused Ion Beam   Thermo Fisher Scientific PhenomXL G2 Desktop SEM · Scanning Electron Microscope   Zeiss Z2 Vario, axio imager · Optical Microscope

  Durham Magneto Optics Microwriter ML3 · Maskless Projection Lithography   Heidelberg Instruments MLA150 System · Maskless Projection Lithography   SUSS MicroTec HMx9 Mask Cleaner · Puddle Mask Cleaner   SUSS MicroTec MA08 Gen4 Mask Aligner · Mask Aligner   SUSS MicroTec MA6 Mask Aligner WD-33-MAN · Mask Aligner   SUSS MicroTec MJB4 Manual Mask Aligner · Mask Aligner

  ADT 7900 DUO 8" dicing system · Dicing Saw   ATV Scribe Station · Manual Scribe Station   Buehler Metaserve · Substrate Thinning   Dynatex DTX150 · Automatic Scribe Station   Loadpoint Nanoace 3 · Dicing Saw   Logitech DL61 · Substrate Thinning   MPP iBond 5000 · Wire Bonder   Manual Cleave · Scribe Bench   Micromanipulator 450PM-B · Probe Station and SMU   SPS UH130 Die matrix expander · Die Expander

  Beneq TFS200 Plasma ALD System · Atomic Layer Deposition   Buehler Syrus LC 3 · Dielectric Evaporator and Sputter Coater   Lesker LabLine with loadlock · Metal Evaporator   Lesker PROLine200 · Metal Evaporator and Sputter Coater   Moorfield Nanotechnology MiniLab ET80A · Metal Evaporator   Moorfield Nanotechnology Minilab S060M · Metal Sputter Coater

  Oxford Instruments Plasma Pro800 · Plasma Deposition   Oxford Instruments PlasmaPro Cobra 300 · Plasma Etcher   Oxford Instruments RIE 80 · Plasma Etcher   Plasma Etch Inc PE-75 Venus · Plasma Asher   SPTS Technologies DELTA · Plasma Deposition   SPTS Technologies OMEGA · Plasma Etcher   SPTS Technologies OMEGA · Plasma Etcher

  Felcon Developer · Wet Bench   SPS 150 · Resist Spin Coater   SUSS MicroTec AD12 · Puddle Developer   SUSS MicroTec HP8 · Hot Plate   SUSS MicroTec Labspin · Resist Spin Coater   SUSS MicroTec MCS8 · Hot Plate   SUSS MicroTec MCS8 · Resist Spin Coater   SUSS MicroTec MCS8 · Adhesion Promoter   SUSS MicroTec SD12 · Puddle Developer

  AET Technologies ALOX · Wet Thermal Oxidation   Carbolite Gero HTMA 4/28 · Curing Oven   ECM Technologies JIPELEC JetFirst100 · Rapid Thermal Annealer   ECM Technologies JIPELEC JetFirst300 · Rapid Thermal Annealer

  Felcon Acid · Wet Bench   Felcon Developer · Wet Bench   Felcon Photoresist · Wet Bench   Felcon Solvents · Wet Bench   SUSS MicroTec HMx9 Mask Cleaner · Puddle Mask Cleaner